Download Advances in Electronic Circuit Packaging: Volume 5 by George R. Dallimore (auth.), Lawrence L. Rosine (eds.) PDF

By George R. Dallimore (auth.), Lawrence L. Rosine (eds.)

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Read Online or Download Advances in Electronic Circuit Packaging: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19–2 PDF

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Additional info for Advances in Electronic Circuit Packaging: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19–2

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Industrial design objectives were to keep all external surface breaks to a minimum, to proportion the control box to suggest stability, and to keep all externallines long and straight. , is 17 in. long, and weighs approximately 3lb (excluding Jens, Jens flattener, handle, aluminum fin, base, and camera head cable). -2 lb. It should be noted at this point • See Thermal Analysis. Fig. 5. Complete electrostatic image orthicon camera system . 32 Edmund C. Decker that the Jens, Jens flattener, handle, base, aluminum fin, and cable arenot included in the weight for the following reasons: 1.

13 shows sleeve-type mounting provisions on both ends of the heat sink for the purpose of direct chassis mounting. ltems A, C, and D of Fig. 14 show heat sinks with both ends enlarged for the purpose of The Heat-Sink Module 55 a b c Fig. 13. Heat-sink modules. increasing the mass of the heat sink at the point of thermal interconnection. This added mass minimizes the possibility of darnage to components in the module from external transient thermal pulses. The possibility of controlled dimension variations is also considered in the design of the new module.

Producibility Norms for Electronic System Packaging E. I. MOORE AND L. M. SCHNEIDER The Martin Company Or/ando, Florida Early evaluation of the producibility of a systems packsging concept can result in considerable cost savings to manufacturers. It is essential that a team eft'ort be conducted among design and manufacturing engineers to assure that the end product can be produced using techniques, processes, and equipment which are available to manufacturing. To REMAIN COMPETITIVE in today's rapidly changing electronics industry, a company's products must, in addition to meeting system functional requirements, be capable of being produced at minimum costs.

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